IP Library Granted Patent US 9,251,942
Granted Patent B2
US 9,251,942 · App. 14/079,040 · Granted Feb 2, 2016

Electronic substrate, semiconductor device, and electronic device

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Quick Facts
Patent No.
US 9,251,942
App. No.
14/079,040
Granted
Feb 2, 2016
Kind
B2
Abstract

An electronic substrate including: a base substrate having an active face and a rear face; and a plurality of inductor elements formed on or above the active face, or formed on or above the rear face.

Claims (24)

1. An electronic substrate comprising:

a base substrate having a first face and a second face opposed to the first face;

a plurality of inductor elements formed on or above the first face, and having a winding wire;

a first electrode and a second electrode formed at a peripheral portion of the first face of the base substrate;

a first connecting wire formed on or above the first face and connected to the first electrode and the winding wire; and

a second connecting wire formed on or above the first face and connected to the second electrode and the winding wire.

2. The electronic substrate according to claim 1 , wherein

a dielectric layer formed between at least some of the inductor elements and the base substrate so as to cover the first connecting wire, including a through hole in which the first connecting wire is connected to the winding wire.

3. The electronic substrate according to claim 1 , wherein

the inductor elements include:

a first inductor element; and

a second inductor element having an inductance value or an applicable frequency that are different from that of the first inductor element.

4. The electronic substrate according to claim 3 , wherein

the first inductor element is used for external power transmission, and the second inductor element is used for external communications.

5. The electronic substrate according to claim 3 , further comprising:

a connection terminal formed on the base substrate, used for external power transmission, wherein

the first inductor element and the second inductor element are used for external communications.

6. The electronic substrate according to claim 2 , wherein

the dielectric layer is made of material having a dielectric dissipation factor smaller than that of the base substrate.

7. An electronic device, comprising:

the electronic substrate according to claim 1 ; and

a body in which the electronic substrate is disposed.

8. The electronic substrate according to claim 1 , wherein

the first electrode and the second electrode are at the same side of the base substrate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2021
From: ADVANCED INTERCONNECT SYSTEMS LIMITED
To: NVIDIA CORPORATION
Reel/Frame 056754/0070 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2021
From: HASHIMOTO, NOBUAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 056318/0277 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2017
From: SEIKO EPSON CORPORATION
To: ADVANCED INTERCONNECT SYSTEMS LIMITED
Reel/Frame 044938/0869 →