Miniature optical element for wireless bonding in an electronic instrument
View Patent ↗A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
1. An optical element, comprising:
a semiconductor chip, the semiconductor chip including a first surface including an optical section and an electrode electrically connected to the optical section, the semiconductor chip including a second surface opposite to the first surface,
the semiconductor chip including a through hole and a conductive layer electrically connected to the electrode, the conductive layer being formed on an internal wall of the through hole and on the second surface.
2. The optical element as defined in claim 1 , further comprising:
an external electrode formed on the second surface of the semiconductor chip and electrically connected to the conductive layer.
3. The optical element as defined in claim 2 , further comprising:
a stress relieving layer formed on the second surface of the semiconductor chip, the conductive layer being formed over the stress relieving layer, and the external electrode being formed in a position on the second surface corresponding to the stress relieving layer.
4. The optical element as defined in claim 1 , further comprising:
a stress relieving layer formed on the second surface of the semiconductor chip, the conductive layer being formed over the stress relieving layer.
5. The optical element as defined in claim 4 , the stress relieving layer comprising resin.
6. The optical element as defined in claim 1 , further comprising:
a light-transmitting member provided on the first surface of the semiconductor chip.
7. The optical element as defined in claim 6 , the light-transmitting member being of substantially a same shape as the semiconductor chip.
8. The optical element as defined in claim 6 , the light-transmitting member comprising an optical glass.
9. The optical element as defined in claim 1 , further comprising:
a color filter provided on the first surface of the semiconductor chip.
10. The optical element as defined in claim 1 , further comprising:
a microlens provided on the first surface of the semiconductor chip.
11. The optical element as defined in claim 1 , wherein the conductive layer is formed for mounting of the optical element without wire bonding.
12. An electronic instrument, comprising:
an optical element that includes a semiconductor chip including a first surface including an optical section and an electrode electrically connected to the optical section, the semiconductor chip including a second surface opposite to the first surface,
the semiconductor chip including a through hole and a conductive layer electrically connected to the electrode, the conductive layer being formed on an internal wall of the through hole and on the second surface.
13. The electronic instrument as defined in claim 12 , further comprising:
a display section that displays an image based on a signal from the optical element.
14. The electronic instrument as defined in claim 12 , wherein the conductive layer is formed for mounting of the optical element without wire bonding.
15. An optical element, comprising:
a semiconductor chip, the semiconductor chip including a first surface including an optical section and an electrode electrically connected to the optical section, the semiconductor chip including a second surface opposite to the first surface,
the semiconductor chip including a through hole and a conductive layer electrically connected to the electrode, the conductive layer being formed on an internal wall of the through hole and on the second surface for mounting of the optical element without wire bonding.