Manufacturing method for an electronic substrate
View Patent ↗The manufacturing method for electronic substrate includes: forming an active region on a first face of a substrate; forming a first part of an interconnection pattern as a passive element on a second face of the substrate; forming an insulating layer as a stress-relieving layer on the second face of the substrate; and forming a second part of the interconnection pattern as the passive element on the insulating layer.
1. A manufacturing method for an electronic substrate, comprising:
forming an active region on a first face of a silicon substrate;
forming a first part of an interconnection pattern as a passive element on a second face of the silicon substrate;
forming a through hole penetrating the silicon substrate;
forming an insulating layer as a resin layer on the second face of the silicon substrate;
forming an insulating film on inner walls of the through hole;
forming a second part of the interconnection pattern as the passive element on the insulating layer; and
providing a semiconductor element on the active region.
2. The manufacturing method for an electronic substrate of claim 1 , further comprising:
forming an electrode on the first face; and
forming a penetrative conductive portion penetrating the silicon substrate and connecting the electrode to the passive element.