Miniature optical element for wireless bonding in an electronic instrument
A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
1. A method of manufacturing an optical element comprising the steps of:
forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and
forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
2. The method of manufacturing an optical element as defined in claim 1 ,
wherein an external electrode which is electrically connected to the conductive layer is formed on the second surface of the semiconductor element.
3. The method of manufacturing an optical element as defined in claim 2 ,
wherein after forming a stress relieving layer on the second surface of the semiconductor element, the conductive layer is formed over the stress relieving layer, and the external electrode is formed in a position on the second surface corresponding to the stress relieving layer.
4. The method of manufacturing an optical element as defined in claim 1 ,
wherein after forming a stress relieving layer on the second surface of the semiconductor element, the conductive layer is formed over the stress relieving layer.
5. The method of manufacturing an optical element as defined in claim 1 ,
wherein the semiconductor element is a semiconductor chip cut from a semiconductor wafer.
6. The method of manufacturing an optical element as defined in claim 5 , wherein:
after forming the conductive layer, a light-transmitting member is provided on the first surface; and
the light-transmitting member is of substantially the same shape as the semiconductor chip.
7. The method of manufacturing an optical element as defined in claim 1 , wherein:
the semiconductor element is part of a semiconductor wafer; and
the semiconductor wafer is cut into individual chips, each of the individual chips being the semiconductor element.
8. The method of manufacturing an optical element as defined in claim 7 , wherein:
after forming the conductive layer, a light-transmitting member is provided on the first surface; and
the light-transmitting member is of substantially the same shape as the semiconductor wafer.
9. The method of manufacturing an optical element as defined in claim 7 , wherein:
after forming the conductive layer, a light-transmitting member is provided on the first surface;
the light-transmitting member is of substantially the same shape as the semiconductor element of the semiconductor wafer;
the electrical characteristics of the semiconductor element of the semiconductor wafer are tested to determine satisfactory portions; and
the light-transmitting member is provided on the semiconductor element determined to be satisfactory portions.
10. The method of manufacturing an optical element as defined in claim 9 ,
wherein the light-transmitting member is provided after the semiconductor wafer is cut.
11. The method of manufacturing an optical element as defined in claim 1 ,
wherein after forming the conductive layer, a light-transmitting member is provided on the first surface.
12. The method of manufacturing an optical element as defined in claim 11 ,
wherein the light-transmitting member is an optical glass.
13. The method of manufacturing an optical element as defined in claim 1 ,
wherein a color filter is provided on the first surface.
14. The method of manufacturing an optical element as defined in claim 1 ,
wherein after forming the conductive layer, microlenses are provided on the first surface.