Miniature optical element for wireless bonding in an electronic instrument
View Patent ↗A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
1. An optical element, comprising:
a semiconductor chip that includes a first surface on which an optical section is formed, a second surface and a through hole, the second surface being opposite to the first surface, the through hole extending from the first surface to the second surface;
a first electrode that is formed on the first surface, the first electrode being electrically connected to the optical section;
a conductive layer that is formed on an internal wall of the through hole, the conductive layer being electrically connected to the first electrode; and
an optical glass that is provided above the first surface.
2. The optical element as defined in claim 1 , further comprising:
a second electrode that is formed on the second surface of the semiconductor chip and electrically connected to the conductive layer.
3. The optical element as defined in claim 1 , further comprising:
a resin formed on the second surface of the semiconductor chip, the conductive layer being formed over the resin.
4. The optical element defined as claim 1 , further comprising:
a bump that is electrically connected to the conductive layer, the bump being formed on a second portion of the conductive layer, the second portion of the conductive layer being formed on the second surface of the semiconductor chip.
5. An electronic instrument, comprising:
an optical element that includes a semiconductor chip including a first surface on which an optical section is formed, a second surface and a through hole, the second surface being opposite to the first surface, the through hole extending from the first surface to the second surface;
a first electrode that is formed on the first surface, the first electrode being electrically connected to the optical section;
a conductive layer that is formed on an internal wall of the through hole, the conductive layer being electrically connected to the first electrode; and
a display section that displays an image based on a signal from the optical element.
6. An optical element, comprising:
a semiconductor chip that includes a first surface on which an optical section is formed, a second surface and a through hole, the second surface being opposite to the first surface, the through hole extending from the first surface to the second surface;
a first electrode that is formed on the first surface, the first electrode being electrically connected to the optical section;
a resin that is formed on the second surface;
a conductive layer that is formed on an internal wall of the through hole, the conductive layer being electrically connected to the first electrode, a first portion of the conductive layer being formed over the resin; and
a second electrode that is electrically connected to the conductive layer, the second electrode being formed on the first portion of the conductive layer.
7. The optical element as defined in claim 6 , further comprising:
a light-transmitting member provided on the first surface of the semiconductor chip.
8. The optical element as defined in claim 6 the light-transmitting member being of substantially a same shape as the semiconductor chip.
9. The optical element as defined in claim 6 , the light-transmitting member comprising glass.
10. An optical element, comprising:
a semiconductor chip that includes a first surface on which an optical section is formed, a second surface and a through hole, the second surface being opposite to the first surface, the through hole extending from the first surface to the second surface;
a first electrode that is formed on the first surface, the first electrode being electrically connected to the optical section;
a conductive layer that is formed on an internal wall of the through hole, the conductive layer being electrically connected to the first electrode; and
a color filter that is provided on the first surface.
11. The optical element defined as claim 10 , further comprising:
a bump that is electrically connected to the conductive layer, the bump being formed on a second portion of the conductive layer, the second portion of the conductive layer being formed on the second surface of the semiconductor chip.
12. An optical element, comprising:
a semiconductor chip that includes a first surface on which an optical section is formed, a second surface and a through hole, the second surface being opposite to the first surface, the through hole extending from the first surface to the second surface;
a first electrode that is formed on the first surface, the first electrode being electrically connected to the optical section;
a conductive layer that is formed on an internal wall of the through hole, the conductive layer being electrically connected to the first electrode; and
a microlens that is provided on the first surface.
13. The optical element defined as claim 12 , further comprising:
a bump that is electrically connected to the conductive layer, the bump being formed on a second portion of the conductive layer, the second portion of the conductive layer being formed on the second surface of the semiconductor chip.