SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
1 . A semiconductor device comprising:
an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face;
an external connection terminal that is disposed at the first face side;
a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and
an electronic element that is disposed at a second face side.
2 . The semiconductor device according to claim 1 , further comprising
a first insulator that is disposed between the conductive portion and a sidewall of the through hole.
3 . The semiconductor device according to claim 1 , further comprising
a second insulator that is disposed between the external connection terminal and the semiconductor substrate.
4 . An electronic component comprising:
an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face;
an external connection terminal that is disposed at the first face side;
an electronic element that is disposed at a second face side of the semiconductor substrate; and
a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal and the electronic element.
5 . The electronic component according to claim 4 , further comprising
a first insulator that is disposed between the conductive portion and a sidewall of the through hole.
6 . The electronic component according to claim 4 , further comprising
a second insulator that is disposed between the external connection terminal and the semiconductor substrate.
7 . A circuit substrate on which the electronic component according to claim 4 is packaged.
8 . An electronic apparatus comprising the electronic component according to claim 4 .