Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
View Patent ↗A semiconductor device includes: a semiconductor substrate having an active surface and a back surface; an integrated circuit formed on the active surface; a feedthrough electrode penetrating the semiconductor substrate, and projecting from the active surface and the back surface; a first resin layer formed on the active surface, having a thickness greater than a height of a portion of the feedthrough electrode that projects from the active surface, and having an opening portion for exposing at least a portion of the feedthrough electrode; a wiring layer which is formed on the first resin layer, and which is connected to the feedthrough electrode through the opening portion; and an external connecting terminal connected to the wiring layer.
1. A semiconductor device comprising:
a semiconductor substrate having an active surface and a back surface;
an integrated circuit formed on the active surface;
a feedthrough electrode penetrating the semiconductor substrate, having a first electrode portion, and projecting from the active surface and the back surface;
a first resin layer formed on the active surface, having a thickness greater than a height of the first electrode portion of the feedthrough electrode that projects from the active surface, and having an opening portion for exposing at least a portion of the first electrode portion of the feedthrough electrode, the opening portion being tapered in which the opening portion has an inner diameter which becomes narrower towards the first electrode portion;
a wiring layer which is formed on the first resin layer so as to be smoothly formed along the taper of the opening portion, and which is connected to the feedthrough electrode through the opening portion; and
an external connecting terminal connected to the wiring layer.
2. A semiconductor device according to claim 1 , further comprising:
a second resin layer formed on the first resin layer, having a thickness greater than a thickness of the wiring layer, and less than a thickness of the first resin layer, and exposing a portion of the wiring layer connected to the external connecting terminal.
3. A semiconductor device according to claim 2 , wherein,
the second resin layer is formed in a region which is positioned in the first resin layer in plan view.
4. A semiconductor device according to claim 1 , further comprising:
a third resin layer formed on the back surface of the semiconductor substrate, and exposing at least an end surface of the feedthrough electrode.
5. A semiconductor device according to claim 1 , further comprising:
other semiconductor device or electronic elements connected to a portion of the feedthrough electrode that projects from the back surface of the semiconductor substrate.
6. A semiconductor device according to claim 5 , further comprising:
a second wiring layer connected to the portion of the feedthrough electrode that projects from the back surface of the semiconductor substrate.
7. A semiconductor device according to claim 5 , further comprising:
a resin molding the other semiconductor device or the electronic parts which are packaged on the back surface.
8. A circuit board comprising the semiconductor device according to claim 1 .
9. An electronic instrument comprising the circuit board according to claim 8 .