Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
View Patent ↗A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.
1. A semiconductor device, comprising:
a semiconductor substrate having a through hole between a first surface and a second surface opposite to each other;
an insulation film provided along an inner surface of the through hole;
a through electrode provided along an inner surface of the insulation film, a through electrode tip of the through electrode protruding relative to the second surface of the semiconductor substrate;
a resin provided along an inner surface of the through electrode inside the through electrode;
an electronic element provided on the second surface, a terminal of the electronic element contacting the through electrode; and
an external terminal provided on or above the first surface of the semiconductor substrate, wherein
the through hole is elongated in one direction in a plan view, and
a plurality of through electrodes are formed side by side in the through hole.
2. The semiconductor device according to claim 1 , wherein
the tip of the through electrode takes the shape of a curved surface, the curved surface being convex outwardly.
3. The semiconductor device according to claim 1 , wherein
the through electrode is in a tapered shape, the tapered shape being tapered toward the electrode tip.
4. The semiconductor device according to claim 1 , wherein
an electrode pad electrically connected to the through electrode is formed on the first surface having an active surface of the semiconductor substrate.
5. The semiconductor device according to claim 4 , wherein
the external terminal electrically connected to the electrode pad is formed on a different position from the electrode pad in a plan view.
6. The semiconductor device according to claim 1 , wherein
the through electrode tip is deformed when the electronic element is mounted on the semiconductor device.
7. An electronic apparatus, comprising a circuit substrate on which the semiconductor device according to claim 1 is mounted.