Patent Assignment
Reel/Frame 011790/0116
Assignment of Assignor's Interest
Recorded: 2001-05-02
Received: 2001-05-16
Pages: 3
Assignor
KAWASHIMA, TOMOHIRO
Executed: 2001-04-23
Assignee
NEC CORPORATION
MINATO-KU, 7-1, SHIBA 5-CHOME, TOKYO, JPX, JAPAN
Covered Property
(1)
Method of Manufacturing a Repairable Flip Chip Semiconductor Device with Excellent Packaging Reliability
Application:
09/847,607 →