Patent Application
Utility
App. No. 09/847,607
· Confirmation No. 5602
METHOD OF MANUFACTURING A REPAIRABLE FLIP CHIP SEMICONDUCTOR DEVICE WITH EXCELLENT PACKAGING RELIABILITY
Inventor:
Tomohiro Kawashima
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-05-02 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-05-02 | SPEC |
Specification | 15 | View | |
| 2001-05-02 | CLM |
Claims | 10 | View | |
| 2001-05-02 | ABST |
Abstract | 1 | View | |
| 2001-05-02 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2001-05-02 | OATH |
Oath or Declaration filed | 1 | View |
Inventors
Tomohiro Kawashima
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/108
H10W74/019
H10W74/012
Y02P70/50
H10P72/7438
H10W72/856
H10W72/07251
H10W74/15
H10W72/012
H10W72/20
H10P72/74
H10W72/251
H10W72/252
H05K3/062
H05K3/3436
H05K2201/0338
H05K2201/1025
H05K2201/10977
H05K2203/0384
Prosecution
- Examiner
- DUONG, KHANH B
- Art Unit
- 2822
- Customer No.
- 26304
- Docket No.
- NECW 18.625
- Confirmation No.
- 5602
Foreign Priority
2000-145314
·
2000-05-17
·
JAPAN
Publication
- Pub. No.
- US20010044198A1
- Pub. Date
- 2001-11-22
Patent Term Adjustment
-44days
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-19
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Quick Facts
- App. No.
- 09/847,607
- Filed
- 2001-05-02
- Granted
- 2003-05-27
- Pub. No.
- US20010044198A1
- Examiner
- DUONG, KHANH B
- Art Unit
- 2822
- PTA
- -44 days
External Links