Patent Assignment
Reel/Frame 013745/0188
Assignment of Assignor's Interest
Recorded: 2003-02-19
Received: 2003-02-26
Pages: 14
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(100)
A Method of Making a Flash Memory Device with an Inverted Tapered Floating Gate
Application:
10/233,798 →
Semiconductor Device
Application:
10/227,648 →
Sealing Resin, Resin-Sealed Semiconductor and System-In-Package
Application:
10/210,770 →
Semiconductor device and manufacturing method thereof
Application:
10/205,196 →
Method and Apparatus for Chemical-Mechanical Polishing
Application:
10/190,016 →
Semiconductor Device
Application:
10/180,602 →
Bonding Tool Capable of Bonding Inner Leads of Tab Tapes to Electrode Pads in High Quality and High Productivity and Bonding Method
Application:
10/179,907 →
Method of Manufacturing Non-Volatile Semiconductor Memory Device
Application:
10/177,280 →
Semiconductor device having capacitor which assures sufficient capacity without requiring large space and method of producing the same
Application:
10/172,121 →
Semiconductor Device Having a Thin Film Capacitor of a Mim (Metal-Insulator-Metal) Structure
Application:
10/170,813 →
Semiconductor Substrate Including Multiple Nitrided Gate Insulating Films
Application:
10/166,189 →
Variable Impedance Circuit
Application:
10/164,510 →
Electrification quantity measurement apparatus, electrification quantity measurement method, static electricity discharge detection apparatus, and static electricity discharge detection method
Application:
10/162,336 →
Semiconductor Device and Method of Fabricating Same
Application:
10/156,408 →
Comparator and Analog-to-Digital Converter
Application:
10/151,415 →
Semiconductor Device
Application:
10/151,416 →
Magnetic Memory and Method of Operation Thereof
Application:
10/141,602 →
Semiconductor device and blowout method of fuse
Application:
10/136,980 →
Fsk Demodulation System
Application:
10/137,008 →
Method for producing semiconductor device
Application:
10/135,026 →
Semiconductor Device
Application:
10/127,266 →
Clock Distribution Circuit
Application:
10/127,297 →
Method and Apparatus for Processing Biologically Hardly Degradable Waste Water Capable of Reducing Ozone
Application:
10/127,632 →
Method of Fabricating Magnetic Random Access Memory Operating Based on Tunnel Magnetroresistance Effect
Application:
10/125,150 →
Manufacturing Method of Semiconductor Device
Application:
10/121,542 →
Digital Vfo Device
Application:
10/116,934 →
Method of Forming Magnetic Memory
Application:
10/116,634 →
Semiconductor Device with Improved Cooling Efficiency and Reduced Electric Resistance
Application:
10/115,524 →
Thin Planar Semiconductor Device Having Electrodes on Both Surfaces and Method of Fabricating Same
Application:
10/100,974 →
Esd Protection Circuit for a Semiconductor Integrated Circuit
Application:
10/099,708 →
Random Number Generator Which Can Generate a Random Number Based on an Uniform Distribution
Application:
10/094,020 →
Method of manufacturing semiconductor devices
Application:
10/094,015 →
Pseudo random signal producing circuit
Application:
10/090,874 →
Method of Testing a Semiconductor Integrated Circuit and Method and Apparatus for Generating Test Patterns
Application:
10/083,447 →
Surface Mountable Chip Type Semiconductor Device and Manufacturing Method
Application:
10/083,998 →
Reticle and Method of Fabricating Semiconductor Device
Application:
10/056,540 →
Semiconductor Device
Application:
10/057,642 →
Semiconductor Memory Device and Manufacturing Method Thereof
Application:
10/046,792 →
Data transmission system
Application:
10/047,283 →
Semiconductor device having resistance elements, and process for fabricating the same
Application:
10/037,434 →
Flip Chip Semiconductor Device Having Signal Pads Arranged Outside of Power Supply Pads
Application:
10/024,154 →
Manufacturing Method of Semiconductor Device and Designing Method of Semiconductor Device
Application:
10/024,157 →
Semiconductor Memory Device with a Silicide Layer Formed on Regions Other Than Source Regions
Application:
10/024,122 →
Semiconductor Device Having Bonding Pad Electrode of Multi-Layer Structure
Application:
10/024,103 →
Video Signal Processing Circuit That Can Correspond to a Plurality of Television Signal Methods
Application:
10/013,821 →
MOS transistor fabrication method
Application:
10/010,339 →
Reference Voltage Generator Circuit for Nonvolatile Memory
Application:
09/997,192 →
Fixed-Length Delay Generation Circuit
Application:
10/015,211 →
Semiconductor Circuit Designing Apparatus and a Semiconductor Circuit Designing Method in Which the Number of Steps in a Circuit Design and a Layout Design Is Reduced
Application:
10/015,209 →
Parllel in Serial Out Circuit Having Flip-Flop Latching at Mutiple Clock Rates
Application:
10/010,073 →
Method for Monitoring an Amount of Heavy Metal Contamination in a Wafer
Application:
10/008,030 →
CMP process for a damascene pattern
Application:
10/015,973 →
Layout method of analog/digital mixed semiconductor integrated circuit
Application:
10/037,373 →
Method of Forming Solder Bumps
Application:
10/047,172 →
Photomask
Application:
09/968,440 →
Semiconductor device manufacturing apparatus and method for manufacturing a semiconductor device
Application:
09/962,169 →
Semiconductor Device and Manufacturing Method Thereof
Application:
09/950,870 →
Processing Apparatus Having Particle Counter and Cleaning Device, Cleaning Method, Cleanliness Diagnosis Method and Semiconductor Fabricating Apparatus Using the Same
Application:
09/950,748 →
Semiconductor Storage Device and Production Method Thereof
Application:
09/944,792 →
Semiconductor Device with Stacked Semiconductor Chips
Application:
09/942,313 →
Semiconductor device of STI structure and method of fabricating MOS transistors having consistent threshold voltages
Application:
09/939,458 →
Semiconductor Having Film Electrodes And Protruding Electrodes On Opposite Surfaces Thereof
Application:
09/939,457 →
Method of Forming a Trench Isolation Structure Resistant to Hot Phosphoric Acid by Extending Trench Liner to Shoulder Portions
Application:
09/916,429 →
Capacitor Electrode Having Uneven Surface Formed by Using Hemispherical Grained Silicon
Application:
09/908,958 →
Semiconductor Device
Application:
09/909,051 →
Active-Matrix Type Display Device
Application:
09/906,996 →
Flip-Chip Type Semiconductor Device Having Split Voids Within Under-Fill Layer and Its Manufacturing Method
Application:
09/904,167 →
Semiconductor Integrated Circuit Including a Plurality of Macros That Can Be Operated Although Their Operational Voltages Are Different from Each Other
Application:
09/902,842 →
Electromigration Evaluation Circuit
Application:
09/902,841 →
Method for Fabricating Semiconductor Device to Increase Strength of Connection Between Solder Balls and Wiring Layer
Application:
09/897,248 →
Semiconductor device and method of manufacturing the same
Application:
09/886,844 →
Manufacturing Method of Semiconductor Device Having Different Gate Oxide Thickness
Application:
09/881,945 →
Semiconductor device with multilayer wiring structure of laminated damascene wiring and fabrication method thereof
Application:
09/879,779 →
Storage device having an error correction function
Application:
09/878,053 →
Heterojunction Bipolar Transistor with Reduced Offset Voltage
Application:
09/874,078 →
Support-Frame Bonding Apparatus
Application:
09/871,371 →
Test Method of Mask for Electron-Beam Exposure and Method of Electron-Beam Exposure
Application:
09/870,219 →
Monitoring resistor element and measuring method of relative preciseness of resistor elements
Application:
09/870,220 →
Apparatus Processing a Gate Portion in a Semiconductor Manufacturing Apparatus, Which Remove a Gate Correspondence Portion from a Semiconductor Package Connected to a Lead Frame, and a Resin Burr Deposited on a Lead Portion Associated with the Semiconductor Packag
Application:
09/870,218 →
Flip Chip Type Semiconductor Device and Method of Manufactruing the Same
Application:
09/866,404 →
Semiconductor Device Having Reinforced Coupling Between Solder Balls and Substrate
Application:
09/865,000 →
Flash Memory Device with an Inverted Tapered Floating Gate
Application:
09/863,705 →
Mask for Electron Beam Drawing Utilizing Auxiliary Patterns That Do Not Bore Through the Substrate
Application:
09/848,124 →
Method of Manufacturing a Repairable Flip Chip Semiconductor Device with Excellent Packaging Reliability
Application:
09/847,607 →
High-Frequency Circuit and Its Module for Communication Devices
Application:
09/842,243 →
Method for Manufacturing Semiconductor Device, and Processing System and Semiconductor Device
Application:
09/840,386 →
Fabrication Method of Implanting Siliconions into the Silicon Substrate
Application:
09/837,956 →
Photomask Pattern Shape Correction Method and Corrected Photomask
Application:
09/837,957 →
Reticle
Application:
09/837,721 →
Non-Volatile Semiconductor Storage Apparatus with Overlapping Gates and Manufacturing Method Thereof
Application:
09/837,734 →
Supply of controlled amount of polishing slurry to semiconductor wafers
Application:
09/825,174 →
Stock/transfer vessel for semiconductor substrate and method of manufacturing semiconductor device
Application:
09/823,058 →
Test method for switching to redundant circuit in SRAM pellet
Application:
09/815,552 →
Method of forming shallow trench isolation
Application:
09/814,013 →
Method of and Apparatus for Performing Circuit-Processing, Method of and Apparatus for Controlling the Motion of the Circuit-Processing Performing Apparatus, and Information Storage Medium
Application:
09/805,390 →
Semiconductor Device and Method for Manufacturing the Same
Application:
09/801,550 →
Synchronous Delay Circuit and Semiconductor Integrated Circuit Apparatus
Application:
09/799,543 →
Plasma CVD apparatus
Application:
09/792,094 →
A Method of Etching Polycrystalline Silicon Film by Using Two Consecutive Dry-Etching Processes
Application:
09/790,075 →
Flip-Chip Type Semiconductor Device and Method of Manufacturing the Same
Application:
09/789,864 →