Patent Application
Utility
App. No. 09/879,779
· Confirmation No. 4158
Semiconductor device with multilayer wiring structure of laminated damascene wiring and fabrication method thereof
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-10-18 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2001-06-12 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-06-12 | SPEC |
Specification | 32 | View | |
| 2001-06-12 | CLM |
Claims | 5 | View | |
| 2001-06-12 | ABST |
Abstract | 1 | View | |
| 2001-06-12 | DRW |
Drawings-only black and white line drawings | 21 | View | |
| 2001-06-12 | OATH |
Oath or Declaration filed | 2 | View | |
| 2001-06-12 | DRW |
Drawings-only black and white line drawings | 21 | View |
Inventors
Noriaki Oda
Tokyo, JAPAN
Toshiyuki Takewaki
Tokyo, JAPAN
Yoshihisa Matsubara
Tokyo, JAPAN
Manabu Iguchi
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/637
H10W20/062
H10W20/081
H10W20/056
Prosecution
Foreign Priority
2000-178684
·
2000-06-14
·
JAPAN
Publication
- Pub. No.
- US20020168812A1
- Pub. Date
- 2002-11-14
No related applications found.
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-19
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-06-12
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