IP Library Assignment 011902/0346
Patent Assignment
Reel/Frame 011902/0346

Assignment of Assignor's Interest

Recorded: 2001-06-12 Received: 2001-06-21 Pages: 5
Assignors
IGUCHI, MANABU
Executed: 2001-06-05
MATSUBARA, YOSHIHISA
Executed: 2001-06-05
ODA, NORIAKI
Executed: 2001-06-05
TAKEWAKI, TOSHIYUKI
Executed: 2001-06-05
Assignee
NEC CORPORATION
MINATO-KU, 7-1, SHIBA 5-CHOME, TOKYO, JPX, JAPAN
Covered Property (1)
Semiconductor device with multilayer wiring structure of laminated damascene wiring and fabrication method thereof
Application: 09/879,779 →