Patent Application
Utility
App. No. 09/825,174
· Confirmation No. 1680
Supply of controlled amount of polishing slurry to semiconductor wafers
Inventor:
Takaharu Kunugi
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-04-03 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-04-03 | SPEC |
Specification | 12 | View | |
| 2001-04-03 | CLM |
Claims | 4 | View | |
| 2001-04-03 | ABST |
Abstract | 1 | View | |
| 2001-04-03 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2001-04-03 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Takaharu Kunugi
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
451/41
H10P52/402
B24B37/04
B24B57/02
Prosecution
- Examiner
- MORGAN, EILEEN P
- Art Unit
- 3723
- Customer No.
- 26304
- Docket No.
- NECW 18.547
- Confirmation No.
- 1680
Foreign Priority
2000-104579
·
2000-04-06
·
JAPAN
Publication
- Pub. No.
- US20020022440A1
- Pub. Date
- 2002-02-21
No related applications found.
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-19
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Quick Facts
- App. No.
- 09/825,174
- Filed
- 2001-04-03
- Pub. No.
- US20020022440A1
- Examiner
- MORGAN, EILEEN P
- Art Unit
- 3723
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