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App. No. 09/870,218 · Confirmation No. 8099

APPARATUS PROCESSING A GATE PORTION IN A SEMICONDUCTOR MANUFACTURING APPARATUS, WHICH REMOVE A GATE CORRESPONDENCE PORTION FROM A SEMICONDUCTOR PACKAGE CONNECTED TO A LEAD FRAME, AND A RESIN BURR DEPOSITED ON A LEAD PORTION ASSOCIATED WITH THE SEMICONDUCTOR PACKAG

Inventor: Takehiko Takahashi
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-05-30 TRNA Transmittal of New Application 2 View
2001-05-30 SPEC Specification 15 View
2001-05-30 CLM Claims 8 View
2001-05-30 ABST Abstract 1 View
2001-05-30 DRW Drawings-only black and white line drawings 6 View
2001-05-30 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
09/870,218
Filed
2001-05-30
Granted
2003-03-04
Pub. No.
US20010049161A1
Art Unit
1725
PTA
0 days