Patent Assignment
Reel/Frame 011860/0787
Assignment of Assignor's Interest
Recorded: 2001-05-30
Pages: 3
Assignor
TAKAHASHI, TAKEHIKO
Executed: 2001-05-24
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU TOKYO, JAPAN
Covered Property
(1)
Apparatus Processing a Gate Portion in a Semiconductor Manufacturing Apparatus, Which Remove a Gate Correspondence Portion from a Semiconductor Package Connected to a Lead Frame, and a Resin Burr Deposited on a Lead Portion Associated with the Semiconductor Packag
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.