Patent Application
Utility
App. No. 09/865,000
· Confirmation No. 2638
SEMICONDUCTOR DEVICE HAVING REINFORCED COUPLING BETWEEN SOLDER BALLS AND SUBSTRATE
Inventor:
Nobuyuki Umezaki
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-05-24 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-05-24 | SPEC |
Specification | 23 | View | |
| 2001-05-24 | CLM |
Claims | 6 | View | |
| 2001-05-24 | ABST |
Abstract | 1 | View | |
| 2001-05-24 | DRW |
Drawings-only black and white line drawings | 4 | View | |
| 2001-05-24 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Nobuyuki Umezaki
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/738
H10W72/00
H05K3/3452
H10W90/701
H10W72/951
H10W72/075
H05K3/3465
H10W74/00
H10W90/754
H05K2201/09909
H05K2201/10977
H05K2203/0588
Prosecution
- Examiner
- MENZ, DOUGLAS M
- Art Unit
- 2824
- Customer No.
- 26304
- Docket No.
- NECB 18.693
- Confirmation No.
- 2638
Foreign Priority
2000-159940
·
2000-05-30
·
JAPAN
Publication
- Pub. No.
- US20010048160A1
- Pub. Date
- 2001-12-06
Patent Term Adjustment
0days
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-19
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Quick Facts
- App. No.
- 09/865,000
- Filed
- 2001-05-24
- Granted
- 2002-11-19
- Pub. No.
- US20010048160A1
- Examiner
- MENZ, DOUGLAS M
- Art Unit
- 2824
- PTA
- 0 days
External Links