Patent Assignment
Reel/Frame 011849/0630
Assignment of Assignor's Interest
Recorded: 2001-05-24
Pages: 3
Assignor
UMEZAKI, NOBUYUKI
Executed: 2001-05-14
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having Reinforced Coupling Between Solder Balls and Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.