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App. No. 09/897,248 · Confirmation No. 1174

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO INCREASE STRENGTH OF CONNECTION BETWEEN SOLDER BALLS AND WIRING LAYER

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2003-08-12 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2003-08-12 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2001-07-02 TRNA Transmittal of New Application 4 View
2001-07-02 A.PE Preliminary Amendment 4 View
2001-07-02 SPEC Specification 23 View
2001-07-02 CLM Claims 6 View
2001-07-02 ABST Abstract 1 View
2001-07-02 DRW Drawings-only black and white line drawings 11 View
2001-07-02 OATH Oath or Declaration filed 4 View
2001-07-02 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
App. No.
09/897,248
Filed
2001-07-02
Pub. No.
US20020000651A1
Examiner
LE, THAO X
Art Unit
2814