Patent Application
Utility
App. No. 09/904,167
· Confirmation No. 2456
FLIP-CHIP TYPE SEMICONDUCTOR DEVICE HAVING SPLIT VOIDS WITHIN UNDER-FILL LAYER AND ITS MANUFACTURING METHOD
Inventor:
Gorou Ikegami
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2003-09-12 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2003-09-12 | LET. |
Miscellaneous Incoming Letter | 1 | View | |
| 2001-07-12 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-07-12 | SPEC |
Specification | 8 | View | |
| 2001-07-12 | CLM |
Claims | 2 | View | |
| 2001-07-12 | ABST |
Abstract | 1 | View | |
| 2001-07-12 | DRW |
Drawings-only black and white line drawings | 12 | View | |
| 2001-07-12 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Gorou Ikegami
Shiga, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/120
H10W76/43
H10W74/01
H10W72/01225
H10W72/856
H10W74/15
H10W72/073
H10W74/012
H10W90/724
H10W72/30
H10W90/734
H10W72/071
H10W72/0711
H10W72/252
Prosecution
- Examiner
- PERKINS, PAMELA E
- Art Unit
- 2822
- Customer No.
- 26304
- Docket No.
- NECR 18.841
- Confirmation No.
- 2456
Foreign Priority
2000-223207
·
2000-07-25
·
JAPAN
Publication
- Pub. No.
- US20020048848A1
- Pub. Date
- 2002-04-25
Patent Term Adjustment
-2days
No related applications found.
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-19
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Quick Facts
- App. No.
- 09/904,167
- Filed
- 2001-07-12
- Granted
- 2003-11-25
- Pub. No.
- US20020048848A1
- Examiner
- PERKINS, PAMELA E
- Art Unit
- 2822
- PTA
- -2 days
External Links