IP Library Patent Application 10317384
Patent Application Utility
App. No. 10/317,384 · Confirmation No. 7452

Repairable flip clip semiconductor device with excellent packaging reliability and method of manufacturing same

Inventor: Tomohiro Kawashima
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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Code Description Pages PDF
2004-07-13 ABN Abandonment 2 View
2004-01-06 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2004-01-06 FOR Foreign Reference 3 View
2004-01-02 CTNF Non-Final Rejection 7 View
2004-01-02 1449 List of References cited by applicant and considered by examiner 1 View
2004-01-02 892 List of references cited by examiner 2 View
2004-01-02 FWCLM Index of Claims 1 View
2004-01-02 SRFW Search information including classification, databases and other search related notes 1 View
2003-03-11 CFILE Request for Corrected Filing Receipt 3 View
2003-03-11 OATH Oath or Declaration filed 1 View
2002-12-12 TRNA Transmittal of New Application 3 View
2002-12-12 A.PE Preliminary Amendment 3 View
2002-12-12 SPEC Specification 15 View
2002-12-12 CLM Claims 10 View
2002-12-12 ABST Abstract 1 View
2002-12-12 DRW Drawings-only black and white line drawings 5 View
2002-12-12 OATH Oath or Declaration filed 1 View
2002-12-12 WFEE Fee Worksheet (SB06) 1 View
2002-12-12 WFEE Fee Worksheet (SB06) 1 View
2002-12-12 WCLM Claims Worksheet (PTO-2022) 1 View
2002-12-12 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2002-12-12 FOR Foreign Reference 7 View
2002-12-12 FOR Foreign Reference 9 View
2002-12-12 FOR Foreign Reference 6 View
2002-12-12 FOR Foreign Reference 31 View
2002-12-12 FOR Foreign Reference 18 View
2002-12-12 FOR Foreign Reference 47 View
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Quick Facts
App. No.
10/317,384
Filed
2002-12-12
Pub. No.
US20030087477A1
Art Unit
2822