IP Library › Assignment 011800/0534
Patent Assignment
Reel/Frame 011800/0534

Assignment of Assignor's Interest

Recorded: 2001-05-04 Pages: 2
Assignors
MISUMI, KAZUYUKI
Executed: 2001-04-16
MICHII, KAZUNARI
Executed: 2001-04-16
HIRATA, YOSHIHIRO
Executed: 2001-04-16
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCH1 2-CHOME, CHIYODA-KU, TOKYO, 100-8, JAPAN
Covered Property (1)
Sealed Semiconductor Device and Lead Frame Used for the Same
Patent: 6,737,733 →
Application: 09/848,256 →
Publication: US 2002/0070431
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 24, 2001
From: MISUMI, KAZUYUKI; MICHII, KAZUNARI; HIRATA, YOSHIHIRO
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 012191/0245 →
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name Sep 8, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0237 →