Assignment of Assignor's Interest

Recorded: 2001-05-16 Received: 2001-05-24 Pages: 2

Assignors

ARIKAWA, NAOSHI

Executed: 2001-04-17

NAGAYA, KAZUHISA

Executed: 2001-04-17

Assignee

NEC CORPORATION

7-1 SHIBA 5-CHOME, MINATO-KU, TOKYO 108-01, JPX, JAPAN

Covered Property (1)

Semiconductor Device with a Corrosion Resistant Bonding Pad and Manufacturing Method Therefor

Application: 09/855,720 →