IP Library Granted Patent US 6,383,909
Granted Patent Utility
US 6,383,909 · Confirmation No. 9417

SEMICONDUCTOR DEVICE WITH A CORROSION RESISTANT BONDING PAD AND MANUFACTURING METHOD THEREFOR

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Code Description Pages PDF
2001-05-16 TRNA Transmittal of New Application 2 View
2001-05-16 ADS Application Data Sheet 2 View
2001-05-16 SPEC Specification 15 View
2001-05-16 CLM Claims 3 View
2001-05-16 ABST Abstract 1 View
2001-05-16 DRW Drawings-only black and white line drawings 7 View
2001-05-16 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,383,909
App. No.
09/855,720
Filed
2001-05-16
Granted
2002-05-07
Art Unit
2812
PTA
0 days