Patent Assignment
Reel/Frame 011818/0773
Assignment of Assignor's Interest
Recorded: 2001-05-16
Pages: 2
Assignors
HIROSE, TAKENORI
Executed: 2001-03-06
NOMOTO, MINEO
Executed: 2001-03-07
KOJIMA, HIROYUKI
Executed: 2001-03-08
SATO, HIDEMI
Executed: 2001-03-08
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Detecting and Measuring Endpoint of Polishing Processing and Its Apparatus and Method of Manufacturing Semiconductor Device Using the Same