Patent Assignment
Reel/Frame 011822/0070
Assignment of Assignor's Interest
Recorded: 2001-05-16
Received: 2001-05-25
Pages: 3
Assignor
PARK, KYE CHAN
Executed: 2001-04-09
Assignee
DONGBU ELECTRONICS CO., LTD.
11F., HANJUNG KANGNAM BLDG., 838, YUKSAM-DONG, KANGNAM-GU, SEOUL, 135-080, KRX, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Metal-Pattern Bonding and Method of Fabricating the Same
Application:
09/858,408 →