IP Library Patent Application 09858408
Patent Application Utility
App. No. 09/858,408 · Confirmation No. 2463

SEMICONDUCTOR PACKAGE HAVING METAL-PATTERN BONDING AND METHOD OF FABRICATING THE SAME

Inventor: Kye Chan Park
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
Code Description Pages PDF
2001-05-16 TRNA Transmittal of New Application 3 View
2001-05-16 A.PE Preliminary Amendment 1 View
2001-05-16 SPEC Specification 8 View
2001-05-16 CLM Claims 5 View
2001-05-16 ABST Abstract 1 View
2001-05-16 DRW Drawings-only black and white line drawings 6 View
2001-05-16 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
09/858,408
Filed
2001-05-16
Granted
2002-08-27
Pub. No.
US20020008315A1
Examiner
HO, TU TU V
Art Unit
2818
PTA
0 days