Patent Application
Utility
App. No. 09/858,408
· Confirmation No. 2463
SEMICONDUCTOR PACKAGE HAVING METAL-PATTERN BONDING AND METHOD OF FABRICATING THE SAME
Inventor:
Kye Chan Park
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-05-16 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-05-16 | A.PE |
Preliminary Amendment | 1 | View | |
| 2001-05-16 | SPEC |
Specification | 8 | View | |
| 2001-05-16 | CLM |
Claims | 5 | View | |
| 2001-05-16 | ABST |
Abstract | 1 | View | |
| 2001-05-16 | DRW |
Drawings-only black and white line drawings | 6 | View | |
| 2001-05-16 | OATH |
Oath or Declaration filed | 4 | View |
Inventors
Kye Chan Park
Kyoungki-so, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Classification
USPC
257/698
H10F39/804
H10W72/00
H10F39/8053
H10W72/856
H10W90/701
H10W74/15
H10W72/90
H10W74/012
H10W90/756
H10W90/724
H10W72/5522
H10W72/9415
H10W90/722
H10W72/5524
Prosecution
- Examiner
- HO, TU TU V
- Art Unit
- 2818
- Customer No.
- 26689
- Docket No.
- TJK/173
- Confirmation No.
- 2463
Foreign Priority
2000-42377
·
2000-07-24
·
REPUBLIC OF KOREA
Publication
- Pub. No.
- US20020008315A1
- Pub. Date
- 2002-01-24
Patent Term Adjustment
0days
No related applications found.
from
PARK, KYE CHAN
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-05-16
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Quick Facts
- App. No.
- 09/858,408
- Filed
- 2001-05-16
- Granted
- 2002-08-27
- Pub. No.
- US20020008315A1
- Examiner
- HO, TU TU V
- Art Unit
- 2818
- PTA
- 0 days
External Links