Patent Assignment
Reel/Frame 011843/0374
Assignment of Assignor's Interest
Recorded: 2001-05-24
Pages: 2
Assignor
GERBSCH, ERICH WILLIAM
Executed: 2001-02-02
Assignee
DELCO ELECTRONICS CORPORATION
KOKOMO, INDIANA
Covered Property
(1)
Interconnect Assembly for an Electronic Assembly and Assembly Method Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.