Patent Assignment
Reel/Frame 011858/0398
Assignment of Assignor's Interest
Recorded: 2001-05-31
Received: 2001-06-07
Pages: 3
Assignors
FUJISAWA, TETSUYA
Executed: 2001-05-09
MAKINO, YUTAKA
Executed: 2001-05-09
MATSUKI, HIROHISA
Executed: 2001-05-09
WATANABE, EIJI
Executed: 2001-05-09
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JPX, JAPAN
Covered Properties
(2)
Semiconductor Device Manufacturing Method Having a Step of Forming a Post Terminal on a Wiring by Electroless Plating
Application:
09/867,545 →
Mixing Blade for a Concrete Mixer
Application:
29/142,544 →