IP Library Granted Patent US 6,566,239
Granted Patent Utility
US 6,566,239 · Confirmation No. 6773

SEMICONDUCTOR DEVICE MANUFACTURING METHOD HAVING A STEP OF FORMING A POST TERMINAL ON A WIRING BY ELECTROLESS PLATING

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Code Description Pages PDF
2001-05-31 TRNA Transmittal of New Application 3 View
2001-05-31 SPEC Specification 18 View
2001-05-31 CLM Claims 2 View
2001-05-31 ABST Abstract 1 View
2001-05-31 DRW Drawings-only black and white line drawings 12 View
2001-05-31 OATH Oath or Declaration filed 5 View
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Quick Facts
Patent No.
US 6,566,239
App. No.
09/867,545
Filed
2001-05-31
Granted
2003-05-20
Pub. No.
US20020076908A1
Art Unit
2829
PTA
0 days