Patent Assignment
Reel/Frame 011860/0773
Assignment of Assignor's Interest
Recorded: 2001-06-01
Pages: 2
Assignor
LIU, ZIYUAN
Executed: 2001-05-16
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Low-resistive tungsten silicide layer strongly adhered to lower layer and semiconductor device using the same
Application:
09/870,688 →
Publication:
US 2001/0051428
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.