IP Library Assignment 011860/0773
Patent Assignment
Reel/Frame 011860/0773

Assignment of Assignor's Interest

Recorded: 2001-06-01 Pages: 2
Assignor
LIU, ZIYUAN
Executed: 2001-05-16
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Low-resistive tungsten silicide layer strongly adhered to lower layer and semiconductor device using the same
Application: 09/870,688 →
Publication: US 2001/0051428
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 19, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013755/0392 →