Patent Assignment
Reel/Frame 011867/0472
Assignment of Assignor's Interest
Recorded: 2001-06-05
Pages: 3
Assignors
INABA, MASATOSHI
Executed: 2001-03-23
SUZUKI, TAKANAO
Executed: 2001-03-26
OMINATO, TADANORI
Executed: 2001-03-26
KAIZU, MASAHIRO
Executed: 2001-03-27
KUROSAKA, AKIHITO
Executed: 2001-03-26
Assignee
FUJIKURA LTD.
1-5-1, KIBA, KOTO-KU, TOKYO 135-8512, JAPAN
Covered Property
(1)
Semiconductor Package, Semiconductor Device, Electronic Device and Production Method for Semiconductor Package
Patent:
6,387,734 →
Application:
09/762,681 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.