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Patent Assignment
Reel/Frame 030159/0720

Assignment of Assignor's Interest

Recorded: 2013-04-05 Pages: 6
Assignor
FUJIKURA LTD.
Executed: 2013-03-15
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Properties (4)
Semiconductor Package, Semiconductor Device, Electronic Device and Production Method for Semiconductor Package
Patent: 6,387,734 →
Application: 09/762,681 →
Semiconductor Device Having Gate Electrode Connection to Wiring Layer
Patent: 7,429,779 →
Application: 11/189,134 →
Publication: US 2006/0022287
Semiconductor Device
Patent: 7,791,187 →
Application: 12/163,581 →
Publication: US 2008/0296762
Wafer Level Chip Scale Package
Patent: 7,863,719 →
Application: 12/848,652 →
Publication: US 2010/0295175
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 5, 2001
From: INABA, MASATOSHI; SUZUKI, TAKANAO; OMINATO, TADANORI; KAIZU, MASAHIRO
To: FUJIKURA LTD.
Reel/Frame 011867/0472 →
Assignment of Assignor's Interest Oct 11, 2005
From: ITOI, KAZUHISA; SATO, MASAKAZU; ITO, TATSUYA
To: FUJIKURA LTD.
Reel/Frame 017068/0154 →
Assignment of Assignor's Interest Jul 7, 2008
From: MUNAKATA, KOJI
To: FUJIKURA LTD.
Reel/Frame 021197/0545 →
Declaration of Ownership Dec 6, 2012
From: FUJIKURA LTD.
To: FUJIKURA LTD.
Reel/Frame 029418/0832 →
Assignment of Assignor's Interest Feb 4, 2021
From: FLIPCHIP INTERNATIONAL, LLC
To: HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
Reel/Frame 055213/0924 →