Semiconductor device having gate electrode connection to wiring layer
View Patent ↗A semiconductor device includes a semiconductor substrate having an electrode formed above a surface thereof; a first insulating resin layer that is provided over the semiconductor substrate and has a first opening defined at a position corresponding to the electrode; a first wiring layer that is provided on the first insulating resin layer and is connected to the electrode through the first opening; a second insulating resin layer provided over the first insulating resin layer and the first wiring layer, the second insulating resin layer having a second opening that is defined at a position different from the position of the first opening in a direction of the surface of the semiconductor substrate; and a second wiring layer that is provided on the second insulating resin layer and is connected to the first wiring layer through the second opening, wherein the second wiring layer includes an induction element, and a sum of a thickness of the first insulating resin layer and a thickness of the second insulating resin layer is not less than 5 μm and not more than 60 μm.
1. A semiconductor device comprising:
a semiconductor substrate having an electrode formed above a surface thereof;
a first insulating resin layer that is provided over the semiconductor substrate and has a first opening defined at a position corresponding to the electrode;
a wiring layer that is formed above the first insulating resin layer and is connected to the electrode through the first opening;
a second insulating resin layer that is formed over the first insulating resin layer and the first wiring layer in the position corresponding to the first wiring layer, the second insulating resin layer having a second opening; and
a second wiring layer that is formed on the second insulating resin layer and has an induction element,
wherein the second wiring layer is connected to the first wiring layer via a junction provided in the second opening,
a width of the junction is equal to or greater than a line width of the second wiring layer that constructs the induction element,
a first contact pad and a second contact pad are provided to the first wiring layer and the second wiring layer, respectively,
the junction is provided between the first contact pad of the first wiring layer and the second contact pad of the second wiring layer, and
a difference between a width C of at least one of the first contact pad of the first wiring layer and the second contact pad of the second wiring layer and a width A of the junction (C-A) is 30 μm or less.
2. The semiconductor device according to claim 1 , wherein the first contact pad and the second contact pad have one of a substantially rectangular shape, a substantially circular shape, or a polygonal shape having five or more sides.
3. The semiconductor device according to claim 1 , wherein the induction element is a spiral coil.
4. The semiconductor device according to claim 2 , wherein the induction element is a spiral coil.