IP Library › Assignment 055213/0924
Patent Assignment
Reel/Frame 055213/0924

Assignment of Assignor's Interest

Recorded: 2021-02-04 Pages: 4
Assignor
FLIPCHIP INTERNATIONAL, LLC
Executed: 2021-01-11
Assignee
HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE, KUNSHAN, JIANGSU, 215300, CHINA
Covered Properties (8)
Semiconductor Device
Patent: 7,791,187 →
Application: 12/163,581 →
Publication: US 2008/0296762
Wafer Level Chip Scale Package
Patent: 7,863,719 →
Application: 12/848,652 →
Publication: US 2010/0295175
Wafer-Level Interconnect for High Mechanical Reliability Applications
Patent: 8,754,524 →
Application: 13/397,876 →
Publication: US 2012/0146219
Solder Bump Interconnect
Patent: 8,446,019 →
Application: 13/457,311 →
Publication: US 2012/0228765
Thin Film Structure for High Density Inductors and Redistribution in Wafer Level Packaging
Patent: 9,018,750 →
Application: 13/572,376 →
Publication: US 2013/0037956
Method for Applying a Final Metal Layer for Wafer Level Packaging and Associated Device
Patent: 8,980,743 →
Application: 13/789,411 →
Publication: US 2013/0328203
Method for Building Vertical Pillar Interconnect
Patent: 9,627,254 →
Application: 13/826,987 →
Publication: US 2013/0196499
Electroplating Using Dielectric Bridges
Patent: 9,070,747 →
Application: 14/039,384 →
Publication: US 2015/0001684
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2008
From: MUNAKATA, KOJI
To: FUJIKURA LTD.
Reel/Frame 021197/0545 →
Assignment of Assignor's Interest Feb 16, 2012
From: CURTIS, ANTHONY; BURGESS, GUY F.; JOHNSON, MICHAEL; TESSIER, TED
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 027715/0853 →
Assignment of Assignor's Interest Apr 30, 2012
From: ALVARADO, REYNANTE; LU, YUAN; REDBURN, RICHARD
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 028126/0819 →
Assignment of Assignor's Interest May 1, 2012
From: ALVARADO, REYNANTE; REDBURN, RICHARD; LU, YUAN
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 028137/0428 →
Assignment of Assignor's Interest Oct 30, 2012
From: FORCIER, ROBERT; SCOTT, DOUGLAS
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 029213/0700 →
Assignment of Assignor's Interest Apr 5, 2013
From: FUJIKURA LTD.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 030159/0720 →
Assignment of Assignor's Interest May 24, 2013
From: BURGESS, GUY F.; BUZARD, SHANNON D.; CURTIS, ANTHONY P.; SCOTT, DOUGLAS M.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 030484/0501 →
Assignment of Assignor's Interest Oct 7, 2013
From: STOUT, EUGENE A.; SCOTT, DOUGLAS M.; CURTIS, ANTHONY P.; TESSIER, THEODORE G.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 031358/0218 →
Assignment of Assignor's Interest Sep 9, 2014
From: BURGESS, GUY F.; CURTIS, ANTHONY P.; STOUT, EUGENE A.; TESSIER, THEODORE G.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 033698/0752 →