Patent Assignment
Reel/Frame 028126/0819
Assignment of Assignor's Interest
Recorded: 2012-04-30
Pages: 3
Assignors
ALVARADO, REYNANTE
Executed: 2007-11-26
LU, YUAN
Executed: 2007-10-08
REDBURN, RICHARD
Executed: 2007-10-08
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Solder Bump Interconnect
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 1, 2012
From: ALVARADO, REYNANTE; REDBURN, RICHARD; LU, YUAN
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 028137/0428 →
Assignment of Assignor's Interest
Feb 4, 2021
From: FLIPCHIP INTERNATIONAL, LLC
To: HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
Reel/Frame 055213/0924 →