Patent Assignment
Reel/Frame 030484/0501
Assignment of Assignor's Interest
Recorded: 2013-05-24
Pages: 6
Assignors
BURGESS, GUY F.
Executed: 2013-02-28
BUZARD, SHANNON D.
Executed: 2013-02-28
CURTIS, ANTHONY P.
Executed: 2013-02-28
SCOTT, DOUGLAS M.
Executed: 2013-02-28
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Method for Applying a Final Metal Layer for Wafer Level Packaging and Associated Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.