Method for applying a final metal layer for wafer level packaging and associated device
View Patent ↗A wafer level semiconductor device and manufacturing method including providing a semiconductor device wafer substrate having a backside, applying to the backside a conductive metallization layer, and applying to the backside over the conductive metallization layer a protective metal layer of titanium, titanium alloys, nickel, nickel alloys, chromium, chromium alloys, cobalt. cobalt alloys, palladium, and palladium alloys.
1. A method comprising:
providing a semiconductor device wafer substrate having a backside;
applying a primary metal layer to the backside;
laser marking the primary metal layer; and
applying over the laser marked primary metal layer a corrosion resistant metal layer, wherein the corrosion resistant metal layer is selected from the group consisting of titanium, titanium alloys, nickel, nickel alloys, chromium, chromium alloys, cobalt, cobalt alloys, tungsten, tungsten alloys, palladium and palladium alloys.
2. The method of claim 1 wherein the primary metal layer is one of copper and a copper alloy.
3. The method of claim 1 wherein the metal layer has a thickness between about 10 Angstroms and about 40,000 Angstroms.
4. The method of claim 1 wherein the primary metal layer is comprised of a metal susceptible to corrosion.
5. The method of claim 1 wherein the primary metal layer is comprised of one or more deposited metal layers with a surface metal layer being a metal susceptible to corrosion.
6. A method comprising:
providing a semiconductor device wafer substrate having a backside;
applying an adhesion metal layer to the backside;
applying to the backside a primary metal layer;
laser marking the primary metal layer; and
applying to the backside, over the laser marked primary metal layer a corrosion resistant metal layer, wherein the corrosion resistant metal is selected from the group consisting of titanium, titanium alloys, nickel, nickel alloys, chromium, chromium alloys, cobalt, cobalt alloys, palladium and palladium alloys.
7. The method of claim 6 wherein the corrosion resistant metal layer has a thickness between about 10 Angstroms and about 40,000 Angstroms.
8. The method of claim 6 wherein the primary metal layer is comprised of one or more deposited metal layers.
9. The method of claim 8 wherein the primary metal layer is a metal chosen from a group consisting of aluminum and its alloys, silver and its alloys, and tungsten and its alloys.
10. The method of claim 6 wherein the primary metal layer is one of copper and a copper alloy.
11. The method of claim 6 wherein the adhesion metal layer is deposited and comprises a metal selected to adhere to the wafer substrate.
12. A method comprising:
providing a semiconductor device wafer substrate having a backside;
applying to the backside a primary metal layer and a corrosion resistant metal layer, wherein the corrosion resistant metal is selected from a group consisting of titanium, titanium alloys, nickel, nickel alloys, chromium, chromium alloys, cobalt, cobalt alloys, tungsten, tungsten alloys, palladium and palladium alloys; and
laser marking the backside of the semiconductor wafer substrate after applying the corrosion resistant metal layer.
13. The method of claim 12 wherein the corrosion resistant metal layer has a thickness between about 10 Angstroms and about 40,000 Angstroms.
14. The method of claim 12 wherein the corrosion resistant metal is titanium.