Patent Assignment
Reel/Frame 027715/0853
Assignment of Assignor's Interest
Recorded: 2012-02-16
Pages: 4
Assignors
CURTIS, ANTHONY
Executed: 2007-02-14
BURGESS, GUY F.
Executed: 2007-02-14
JOHNSON, MICHAEL
Executed: 2007-02-14
TESSIER, TED
Executed: 2007-02-15
LU, YUAN
Executed: 2007-03-05
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Wafer-Level Interconnect for High Mechanical Reliability Applications
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.