Patent Assignment
Reel/Frame 029213/0700
Assignment of Assignor's Interest
Recorded: 2012-10-30
Pages: 3
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Thin Film Structure for High Density Inductors and Redistribution in Wafer Level Packaging
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.