Patent Assignment
Reel/Frame 011876/0130
Assignment of Assignor's Interest
Recorded: 2001-06-01
Received: 2001-06-13
Pages: 3
Assignee
SILICON INTEGRATED SYSTEMS CORP.
SCIENCE-BASED INDUSTRIAL PARK, NO. 16, CREATION ROAD 1, HSINCHU, TWX, TAIWAN
Covered Property
(1)
Method for Measuring Width of Bottom Under Cut During Etching Process
Application:
09/873,157 →