Patent Assignment
Reel/Frame 011886/0090
Assignment of Assignor's Interest
Recorded: 2001-06-05
Pages: 3
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Property
(1)
Flexible Ball Grid Array Chip Scale Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.