Patent Assignment
Reel/Frame 011892/0924
Assignment of Assignor's Interest
Recorded: 2001-06-06
Received: 2001-06-19
Pages: 3
Assignor
SINIAGUINE, OLEG
Executed: 2001-05-05
Assignee
TRU-SI TECHNOLOGIES, INC.
657 N. PASTORIA AVENUE, SUNNYVALE, CA, 94086, UNITED STATES
Covered Properties
(2)
Thinning and Dicing of Semiconductor Wafers Using Dry Etch, and Obtaining Semiconductor Chips with Rounded Bottom Edges and Corners
Application:
09/876,888 →
Methods for Reducing Entrainment of Solids and Liquids
Application:
09/872,739 →