IP Library Assignment 011892/0924
Patent Assignment
Reel/Frame 011892/0924

Assignment of Assignor's Interest

Recorded: 2001-06-06 Received: 2001-06-19 Pages: 3
Assignor
SINIAGUINE, OLEG
Executed: 2001-05-05
Assignee
TRU-SI TECHNOLOGIES, INC.
657 N. PASTORIA AVENUE, SUNNYVALE, CA, 94086, UNITED STATES
Covered Properties (2)
Thinning and Dicing of Semiconductor Wafers Using Dry Etch, and Obtaining Semiconductor Chips with Rounded Bottom Edges and Corners
Application: 09/876,888 →
Methods for Reducing Entrainment of Solids and Liquids
Application: 09/872,739 →