IP Library Granted Patent US 6,498,074
Granted Patent Utility
US 6,498,074 · Confirmation No. 7821

THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS

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Code Description Pages PDF
2020-06-11 OATH Oath or Declaration filed 262 View
2012-07-09 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-07-09 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-06-21 PA.. Power of Attorney 1 View
2012-06-21 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2012-06-21 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-06-06 TRNA Transmittal of New Application 1 View
2001-06-06 SPEC Specification 12 View
2001-06-06 CLM Claims 2 View
2001-06-06 ABST Abstract 1 View
2001-06-06 DRW Drawings-only black and white line drawings 8 View
2001-06-06 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,498,074
App. No.
09/876,888
Filed
2001-06-06
Granted
2002-12-24
Pub. No.
US20020013061A1
Examiner
ROMAN, ANGEL
Art Unit
2812
PTA
-103 days