Patent Assignment
Reel/Frame 013821/0206
Assignment of Assignor's Interest
Recorded: 2003-03-10
Received: 2003-03-12
Pages: 4
Assignor
TRUSI TECHNOLOGIES, LLC
Executed: 2003-02-11
Assignee
TRU-SI TECHNOLOGIES, INC.
657 N. PASTORIA AVENUE, SUNNYVALE, CA, 94085, UNITED STATES
Covered Properties
(3)
Integrated Circuit Structures with a Conductor Formed in a Through Hole in a Semiconductor Substrate and Protruding from a Surface of the Substrate
Application:
10/059,898 →
System and method for managing object-based clusters
Application:
60/303,425 →
Thinning and Dicing of Semiconductor Wafers Using Dry Etch, and Obtaining Semiconductor Chips with Rounded Bottom Edges and Corners
Application:
09/876,888 →