Patent Assignment
Reel/Frame 012178/0490
Assignment of Assignor's Interest
Recorded: 2001-09-18
Received: 2001-09-25
Pages: 3
Assignee
TRU-SI TECHNOLOGIES, INC.
657 N. PASTORIA AVENUE, SUNNYVALE, CA, 94086, UNITED STATES
Covered Property
(1)
Thinning and Dicing of Semiconductor Wafers Using Dry Etch, and Obtaining Semiconductor Chips with Rounded Bottom Edges and Corners
Application:
09/876,888 →