IP Library › Assignment 011906/0680
Patent Assignment
Reel/Frame 011906/0680

Assignment of Assignor's Interest

Recorded: 2001-05-31 Pages: 5
Assignors
PATTANAIK, SURYA
Executed: 2001-05-21
SATOH, TAKUYA
Executed: 2001-05-22
TSUCHIYA, TATSUMI
Executed: 2001-05-22
YOSHIDA, TATSUSHI
Executed: 2001-05-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORP.
NEW ORCHARD ROAD, NEW YORK, NEW YORK, 10504
Covered Property (1)
Solder-Ball Bonding Device and Method
Patent: 6,543,677 →
Application: 09/872,252 →
Publication: US 2002/0179696
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 21, 2005
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 016824/0508 →