Patent Application
Utility
App. No. 09/872,252
· Confirmation No. 4745
SOLDER-BALL BONDING DEVICE AND METHOD
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-05-31 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-05-31 | SPEC |
Specification | 17 | View | |
| 2001-05-31 | CLM |
Claims | 3 | View | |
| 2001-05-31 | ABST |
Abstract | 1 | View | |
| 2001-05-31 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2001-05-31 | OATH |
Oath or Declaration filed | 8 | View |
Inventors
Surya Pattanaik
San Jose, CA
Takuya Satoh
Kanagawa-ken, JAPAN
Tatsumi Tsuchiya
Ayase-shi, JAPAN
Tatsushi Yoshida
Chigasaki-shi, JAPAN
Attorneys & Agents of Record
Classification
USPC
228/246
Prosecution
- Examiner
- EDMONDSON, LYNNE RENEE
- Art Unit
- 1725
- Docket No.
- JP920000148US1
- Confirmation No.
- 4745
Publication
- Pub. No.
- US20020179696A1
- Pub. Date
- 2002-12-05
Patent Term Adjustment
0days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2005-09-21
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-05-31
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Quick Facts
- App. No.
- 09/872,252
- Filed
- 2001-05-31
- Granted
- 2003-04-08
- Pub. No.
- US20020179696A1
- Examiner
- EDMONDSON, LYNNE RENEE
- Art Unit
- 1725
- PTA
- 0 days
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