IP Library Assignment 011926/0289
Patent Assignment
Reel/Frame 011926/0289

Assignment of Assignor's Interest

Recorded: 2001-06-21 Received: 2001-06-28 Pages: 3
Assignors
MIN, GYUNG-JIN
Executed: 2001-06-06
PARK, WAN-JAE
Executed: 2001-06-06
JEON, JEONG-SIC
Executed: 2001-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KRX, KOREA, REPUBLIC OF
Covered Property (1)
Method of Forming Interlevel Dielectric Layer of Semiconductor Device
Application: 09/885,091 →