Patent Assignment
Reel/Frame 011926/0289
Assignment of Assignor's Interest
Recorded: 2001-06-21
Received: 2001-06-28
Pages: 3
Assignors
MIN, GYUNG-JIN
Executed: 2001-06-06
PARK, WAN-JAE
Executed: 2001-06-06
JEON, JEONG-SIC
Executed: 2001-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KRX, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Interlevel Dielectric Layer of Semiconductor Device
Application:
09/885,091 →