IP Library Granted Patent US 6,479,399
Granted Patent Utility
US 6,479,399 · Confirmation No. 3925

METHOD OF FORMING INTERLEVEL DIELECTRIC LAYER OF SEMICONDUCTOR DEVICE

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Code Description Pages PDF
2001-06-21 TRNA Transmittal of New Application 4 View
2001-06-21 A.PE Preliminary Amendment 3 View
2001-06-21 SPEC Specification 7 View
2001-06-21 CLM Claims 3 View
2001-06-21 ABST Abstract 1 View
2001-06-21 DRW Drawings-only black and white line drawings 2 View
2001-06-21 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,479,399
App. No.
09/885,091
Filed
2001-06-21
Granted
2002-11-12
Pub. No.
US20020064936A1
Art Unit
2812
PTA
0 days